ON Semiconductor ENGR CONSULT, PACKAGE DEVELOPMENT in Bucheon, South Korea

  • Technical leader responsible for cooling heat-sink material & stack process development for AHPM DSC, SSC and Direct cooling modules that meets thermal performance (Rthjf) and pressure drop (dP) requirements

  • Technical leader responsible for POC (Proof of concept) projects for advanced new power module packaging technology research & development

  • Over 10 years experience in Semiconductor Power discrete or module package research and development, assembly process development, material development

  • Experinece in mechanical design, simulation and development for cooling heat-sink material

  • Fluent english communication skill and good CAD skill

  • Ph.D or master degree preferred with a major of mechanics, material science, metallurgy

Job: Engineering


Location: KR-KR-Bucheon-si, Gyeonggi-do

Requisition ID: 1800899

ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.